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74ALVC125
Quad buffer/line driver; 3-state
Rev. 02 -- 10 January 2008 Product data sheet
1. General description
The 74ALVC125 is a quad non-inverting buffer/line driver with 3-state outputs. The 3-state outputs (nY) are controlled by the output enable input (nOE). A HIGH on the nOE pin causes the outputs to assume a high-impedance OFF-state.
2. Features
s s s s s s s Wide supply voltage range from 1.65 V to 3.6 V 3.6 V tolerant inputs/outputs CMOS low power consumption Direct interface with TTL levels (2.7 V to 3.6 V) Power-down mode Latch-up performance exceeds 250 mA Complies with JEDEC standards: x JESD8-7 (1.65 V to 1.95 V) x JESD8-5 (2.3 V to 2.7 V) x JESD8B/JESD36 (2.7 V to 3.6 V) s ESD protection: x HBM JESD22-A114E exceeds 2000 V x MM JESD22-A 115-A exceeds 200 V
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74ALVC125D -40 C to +85 C SO14 TSSOP14 Description plastic small outline package; 14 leads; body width 3.9 mm plastic thin shrink small outline package; 14 leads; body width 4.4 mm Version SOT108-1 SOT402-1 SOT762-1 Type number
74ALVC125PW -40 C to +85 C 74ALVC125BQ -40 C to +85 C
DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
4. Functional diagram
2 1 5 4 9 10 12 13
1A 1OE 2A 2OE
1Y
3 2 1
3
2Y
6
1 5
EN1
6
4 3A 3OE 4A 4OE
mna228
3Y
8
9 8 10
4Y
11
12 11 13
mna229
Fig 1. Logic symbol
Fig 2. IEC logic symbol
nA
nY
nOE
mna227
Fig 3. Logic diagram (one buffer)
5. Pinning information
5.1 Pinning
74ALVC125
1OE 2 3 4 5 6 7 GND 3Y 8 GND(1) 1 terminal 1 index area 14 VCC 13 4OE 12 4A 11 4Y 10 3OE 9 3A
74ALVC125
1OE 1A 1Y 2OE 2A 2Y GND 1 2 3 4 5 6 7
001aah089
1A 14 VCC 13 4OE 12 4A 11 4Y 10 3OE 9 8 3A 3Y 2Y 1Y 2OE 2A
001aah090
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig 4. Pin configuration SO14 and TSSOP14
74ALVC125_2
Fig 5. Pin configuration DHVQFN14
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
2 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
5.2 Pin description
Table 2. Symbol nA nY nOE VCC GND Pin description Pin 2, 5, 9, 12 3, 6, 8, 11 1, 4, 10, 13 14 7 Description data input bus output output enable (active LOW) supply voltage ground (0 V)
6. Functional description
Table 3. Input nOE L L H
[1] H = HIGH voltage level L = LOW voltage level X= don't care Z = high-impedance OFF-state
Function table[1] Output nA L H X nY L H Z
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO Parameter supply voltage input clamping current input voltage output clamping current output voltage VO > VCC or VO < 0 V output HIGH or LOW state output 3-state Power-down mode, VCC = 0 V IO ICC IGND Tstg Ptot
[1] [2] [3]
[2] [1][2]
Conditions VI < 0 V
[1]
Min -0.5 -50 -0.5 -0.5 -0.5 -0.5 -100 -65
Max +4.6 +4.6 50 VCC + 0.5 +4.6 +4.6 50 100 +150 500
Unit V mA V mA V V V mA mA mA C mW
output current supply current ground current storage temperature total power dissipation
VO = 0 V to VCC
Tamb = -40 C to +85 C
[3]
-
The minimum input voltage ratings may be exceeded if the input current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation. For SO14 packages: above 70 C derate linearly with 8 mW/K. For TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 C derate linearly with 4.5 mW/K.
(c) NXP B.V. 2008. All rights reserved.
74ALVC125_2
Product data sheet
Rev. 02 -- 10 January 2008
3 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
8. Recommended operating conditions
Table 5. Symbol VCC VI VO Recommended operating conditions Parameter supply voltage input voltage output voltage output HIGH or LOW state output 3-state Power-down mode; VCC = 0 V Tamb t/V ambient temperature input transition rise and fall rate in free air VCC = 1.65 V to 2.7 V VCC = 2.7 V to 3.6 V Conditions Min 1.65 0 0 0 0 -40 0 0 Max 3.6 3.6 VCC 3.6 3.6 +85 20 10 Unit V V V V V C ns/V ns/V
9. Static characteristics
Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH HIGH-level input voltage Conditions Min VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 3.6 V IO = -6 mA; VCC = 1.65 V IO = -12 mA; VCC = 2.3 V IO = -18 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -18 mA; VCC = 3.0 V IO = -24 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 3.6 V IO = 6 mA; VCC = 1.65 V IO = 12 mA; VCC = 2.3 V IO = 18 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 18 mA; VCC = 3.0 V IO = 24 mA; VCC = 3.0 V II input leakage current VCC = 3.6 V; VI = 3.6 V or GND 0.11 0.17 0.25 0.16 0.23 0.30 0.1 0.2 0.3 0.4 0.6 0.4 0.4 0.55 5 V V V V V V V A VCC - 0.2 1.25 1.8 1.7 2.2 2.4 2.2 1.51 2.10 2.01 2.53 2.76 2.68 V V V V V V V 0.65 x VCC 1.7 2.0 -40 C to +85 C Typ[1] Max 0.7 0.8 V V V V V Unit
0.35 x VCC V
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
4 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
Table 6. Static characteristics ...continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter IOZ IOFF ICC ICC CI
[1]
Conditions Min VI = VIH or VIL; VCC = 1.65 V to 3.6 V; VO = 3.6 V or GND; VCC = 0 V; VI or VO = 0 V to 3.6 V VCC = 3.6 V; VI = VCC or GND; IO = 0 A per input pin; VCC = 3.0 V to 3.6 V; VI = VCC - 0.6 V; IO = 0 A -
-40 C to +85 C Typ[1] 0.1 0.1 0.2 5 3.5 Max 10 10 10 750 -
Unit A A A A pF
OFF-state output current power-off leakage current supply current additional supply current input capacitance
All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
10. Dynamic characteristics
Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol tpd Parameter propagation delay Conditions nA to nY; see Figure 6 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V ten enable time nOE to nY; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V tdis disable time nOE to nY; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V
[2] [2] [2]
-40 C to +85 C Min 1.3 1.0 1.1 1.4 1.0 1.0 1.8 1.0 1.4 Typ[1] 2.4 1.7 2.0 1.8 3.9 2.2 2.7 1.9 3.9 2.1 2.9 2.7 Max 5.3 3.2 3.1 2.8 6.4 4.1 4.3 3.5 5.9 3.4 4.0 4.0
Unit
ns ns ns ns ns ns ns ns ns ns ns ns
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
5 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
Table 7. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol CPD Parameter power dissipation capacitance Conditions per buffer; VI = GND to VCC; VCC = 3.3 V outputs HIGH or LOW state outputs 3-state
[1] [2] Typical values are measured at Tamb = 25 C tpd is the same as tPHL and tPLH. ten is the same as tPZH and tPZL. tdis is the same as tPHZ and tPLZ. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of inputs switching (CL x VCC2 x fo) = sum of the outputs
[3]
-40 C to +85 C Min Typ[1] 27 5 Max -
Unit
pF pF
[3]
11. Waveforms
VI nA input GND
VM
tPHL VOH
nY output VOL
tPLH
VM
mna230
Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 6. Input nA to output nY propagation delay times Table 8. VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V Measurement points Input VM 0.5VCC 0.5VCC 1.5 V 1.5 V Output VM 0.5VCC 0.5VCC 1.5 V 1.5 V VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VY VOH - 0.15 V VOH - 0.15 V VOH - 0.3 V VOH - 0.3 V
Supply voltage
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
6 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
VI nOE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
mna362
Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 7. Enable and disable times
VEXT VCC VI VO DUT
RT CL RL RL
G
mna616
Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times.
Fig 8. Test circuitry for switching times Table 9. Test data Input VI 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V VCC VCC 2.7 V 2.7 V tr, tf 2.0 ns 2.0 ns 2.5 ns 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF RL 1 k 500 500 500 VEXT tPLH, tPHL open open open open tPLZ, tPZL 2 x VCC 2 x VCC 6V 6V tPHZ, tPZH GND GND GND GND
Supply voltage
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
7 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 pin 1 index Lp 1 e bp 7 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
0.028 0.004 0.012
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 9. Package outline SOT108-1 (SO14)
74ALVC125_2 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
8 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 10. Package outline SOT402-1 (TSSOP14)
74ALVC125_2 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
9 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 6 vMCAB wM C y1 C
C y
1 Eh 14
7 e 8
13 Dh 0
9 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.1 2.9 Dh 1.65 1.35 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT762-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
Fig 11. Package outline SOT762-1 (DHVQFN14)
74ALVC125_2 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
10 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
13. Abbreviations
Table 10. Acronym CDM DUT ESD HBM MM TTL Abbreviations Description Charged-Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
14. Revision history
Table 11. Revision history Release date 20080110 Data sheet status Product data sheet Change notice Supersedes 74ALVC125_1 Document ID 74ALVC125_2 Modifications:
* * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 3: DHVQFN14 package added. Section 7: derating values added for DHVQFN14 package. Section 12: outline drawing added for DHVQFN14 package. Product specification -
74ALVC125_1
20021118
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
11 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
15.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
74ALVC125_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 10 January 2008
12 of 13
NXP Semiconductors
74ALVC125
Quad buffer/line driver; 3-state
17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 January 2008 Document identifier: 74ALVC125_2

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